create_pcb_from_3dlayout#

Icepak.create_pcb_from_3dlayout(component_name: str, project_name: str, design_name: str, resolution: int | None = 2, extent_type: str | None = 'Bounding Box', outline_polygon: str | None = '', close_linked_project_after_import: bool | None = True, custom_x_resolution: int | None = None, custom_y_resolution: int | None = None, power_in: float | None = 0, rad: str | None = 'Nothing', **kwargs) → bool#

Create a PCB component in Icepak that is linked to an HFSS 3DLayout object linking only to the geometry file.

Note

No solution is linked.

Parameters:
component_namestr

Name of the new PCB component to create in Icepak.

project_namestr

Name of the project or the full path to the project.

design_namestr

Name of the design.

resolutionint, optional

Resolution of the mapping. The default is 2.

extent_typestr, optional

Type of the extent. Options are "Polygon" and "Bounding Box". The default is "Bounding Box".

outline_polygonstr, optional

Name of the outline polygon if extent_type="Polygon". The default is "".

close_linked_project_after_importbool, optional

Whether to close the linked AEDT project after the import. The default is True.

custom_x_resolutionint, optional

The default is None.

custom_y_resolutionint, optional

The default is None.

power_infloat, optional

Power in Watt.

radstr, optional

Radiating faces. Options are:

  • "Nothing"

  • "Low"

  • "High"

  • "Both"

The default is "Nothing".

Returns:
bool

True when successful, False when failed.

References

>>> oModule.InsertNativeComponent