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Icepak: thermal analysis with 3D components#
This example shows how to create a thermal analysis of an electronic package by taking advantage of 3D components and features added by PyAEDT.
Import PyAEDT and download files#
Perform import of required classes from the pyaedt package and import the os package.
from pyaedt import Icepak, generate_unique_folder_name, downloads, settings
import os
# Download needed files
temp_folder = generate_unique_folder_name()
package_temp_name, qfp_temp_name = downloads.download_icepak_3d_component(temp_folder)
Create heatsink#
Open a new project in non-graphical mode.
ipk = Icepak(projectname=os.path.join(temp_folder, "Heatsink.aedt"), specified_version="2023.2", non_graphical=True,
close_on_exit=True, new_desktop_session=True)
# Remove air region created by default because it is not needed as the heatsink will be exported as a 3dcomponent
ipk.modeler.get_object_from_name("Region").delete()
# Definition of heatsink with boxes
hs_base = ipk.modeler.create_box(position=[0, 0, 0], dimensions_list=[37.5, 37.5, 2], name="HS_Base")
hs_base.material_name="Al-Extruded"
hs_fin = ipk.modeler.create_box(position=[0, 0, 2], dimensions_list=[37.5, 1, 18], name="HS_Fin1")
hs_fin.material_name="Al-Extruded"
hs_fin.duplicate_along_line([0, 3.65, 0], nclones=11)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "Heatsink.jpg"))
# Definition of a mesh region. First a non-model box is created, then the mesh region is assigned
mesh_box = ipk.modeler.create_box(position=[-2, -2, -3], dimensions_list=[41.5, 41.5, 24])
mesh_box.model = False
mesh_region = ipk.mesh.assign_mesh_region([mesh_box.name])
mesh_region.UserSpecifiedSettings = True
mesh_region.MaxElementSizeX = "5mm"
mesh_region.MaxElementSizeY = "5mm"
mesh_region.MaxElementSizeZ = "1mm"
mesh_region.MinElementsInGap = "4"
mesh_region.MaxLevels = "2"
mesh_region.BufferLayers = "1"
mesh_region.update()
# Assignment of monitor objects
hs_fin5_object = ipk.modeler.get_object_from_name("HS_Fin1_5")
point_monitor_position = [0.5 * (hs_base.bounding_box[i] + hs_base.bounding_box[i + 3]) for i in range(2)] + [
hs_fin5_object.bounding_box[-1]] # average x,y, top z
ipk.monitor.assign_point_monitor(point_monitor_position, monitor_quantity=["Temperature", "HeatFlux"],
monitor_name="TopPoint")
ipk.monitor.assign_face_monitor(hs_base.bottom_face_z.id, monitor_quantity="Temperature", monitor_name="Bottom")
ipk.monitor.assign_point_monitor_in_object("HS_Fin1_5", monitor_quantity="Temperature", monitor_name="Fin5Center")
# Export the heatsink 3D component and close project. auxiliary_dict is set to true in order to export the
# monitor objects along with the .a3dcomp file.
os.mkdir(os.path.join(temp_folder, "componentLibrary"))
ipk.modeler.create_3dcomponent(
os.path.join(temp_folder, "componentLibrary", "Heatsink.a3dcomp"),
component_name="Heatsink",
auxiliary_dict=True
)
ipk.close_project(save_project=False)
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Create QFP#
Download and open a project containing a QPF.
ipk = Icepak(projectname=qfp_temp_name)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "QFP2.jpg"))
# Create dataset for power dissipation.
x_datalist = [45, 53, 60, 70]
y_datalist = [0.5, 3, 6, 9]
ipk.create_dataset(
"PowerDissipationDataset",
x_datalist,
y_datalist,
zlist=None,
vlist=None,
is_project_dataset=False,
xunit="cel",
yunit="W",
zunit="",
vunit="",
)
# Assign source power condition to the die.
ipk.create_source_power(
"DieSource",
thermal_dependent_dataset="PowerDissipationDataset",
source_name="DieSource"
)
# Assign thickness to the die attach surface.
ipk.create_conduting_plate(face_id="Die_Attach",
thermal_specification="Thickness",
shell_conduction=True,
thickness="0.05mm",
solid_material="Epoxy Resin-Typical",
bc_name="Die_Attach",
)
# Assign monitor objects.
ipk.monitor.assign_point_monitor_in_object("QFP2_die", monitor_quantity="Temperature", monitor_name="DieCenter")
ipk.monitor.assign_surface_monitor("Die_Attach", monitor_quantity="Temperature", monitor_name="DieAttach")
# Export the QFP 3D component and close project. Here the auxiliary dictionary allows exporting not only the monitor
# objects but also the dataset used for the power source assignment.
ipk.modeler.create_3dcomponent(
os.path.join(temp_folder, "componentLibrary", "QFP.a3dcomp"),
component_name="QFP",
auxiliary_dict=True,
datasets=["PowerDissipationDataset"]
)
ipk.close_project(save_project=False)
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Create electronic package#
Download and open a project containing the electronic package.
ipk = Icepak(projectname=package_temp_name)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "electronic_package_missing_obj.jpg"))
# The heatsink and the QFP are missing. They can be inserted as 3d components. The auxiliary files are needed since
# the aim is to import also monitor objects and datasets. Also, a coordinate system is created for the heatsink so
# that it is placed on top of the AGP.
agp = ipk.modeler.get_object_from_name("AGP_IDF")
cs = ipk.modeler.create_coordinate_system(
origin=[agp.bounding_box[0], agp.bounding_box[1], agp.bounding_box[-1]],
name="HeatsinkCS",
reference_cs="Global",
x_pointing=[1, 0, 0],
y_pointing=[0, 1, 0],
)
heatsink_obj = ipk.modeler.insert_3d_component(
comp_file=os.path.join(temp_folder, "componentLibrary", "Heatsink.a3dcomp"),
targetCS="HeatsinkCS", auxiliary_dict=True)
QFP2_obj = ipk.modeler.insert_3d_component(
comp_file=os.path.join(temp_folder, "componentLibrary", "QFP.a3dcomp"),
targetCS="Global", auxiliary_dict=True)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "electronic_package.jpg"))
# Create a coordinate system at the xmin, ymin, zmin of the model
bounding_box = ipk.modeler.get_model_bounding_box()
cs_pcb_assembly = ipk.modeler.create_coordinate_system(
origin=[bounding_box[0], bounding_box[1], bounding_box[2]],
name="PCB_Assembly",
reference_cs="Global",
x_pointing=[1, 0, 0],
y_pointing=[0, 1, 0],
)
# Export of the whole assembly as 3d component and close project. First, a flattening is needed because nested 3d
# components are not natively supported. Then it is possible to export the whole package as 3d component. Here the
# auxiliary dictionary is needed to export monitor objects, datasets and native components.
ipk.flatten_3d_components()
ipk.modeler.create_3dcomponent(
component_file=os.path.join(temp_folder, "componentLibrary", "PCBAssembly.a3dcomp"),
component_name="PCBAssembly",
auxiliary_dict=True,
included_cs=["Global", "HeatsinkCS", "PCB_Assembly"],
reference_cs="PCB_Assembly"
)
ipk.close_project(save_project=False)
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C:\actions-runner\_work\pyaedt\pyaedt\testenv\lib\site-packages\pyaedt\modeler\cad\Primitives3D.py:1297: ResourceWarning: unclosed file <_io.TextIOWrapper name='D:\\Temp\\pyaedt_prj_PHE\\componentLibrary\\Heatsink.a3dcomp.json' mode='r' encoding='cp1252'>
aux_dict = json.load(open(auxiliary_dict, "r"))
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C:\actions-runner\_work\pyaedt\pyaedt\testenv\lib\site-packages\pyaedt\modeler\cad\Primitives3D.py:1297: ResourceWarning: unclosed file <_io.TextIOWrapper name='D:\\Temp\\pyaedt_prj_PHE\\componentLibrary\\QFP.a3dcomp.json' mode='r' encoding='cp1252'>
aux_dict = json.load(open(auxiliary_dict, "r"))
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Create main assembly#
Open a new empty project.
ipk = Icepak(projectname=os.path.join(temp_folder, "main_assembly.aedt"))
# Create a support for multiple PCB assemblies
support_obj = ipk.modeler.create_box(position=[-60, -160, 0], dimensions_list=[270, 580, -10], name="PCB_support")
support_obj.material_name="plexiglass"
# Create two coordinate systems to place two electronic package assemblies
cs1 = ipk.modeler.create_coordinate_system(
origin=[-40, -120, 0],
name="PCB1",
reference_cs="Global",
x_pointing=[1, 0, 0],
y_pointing=[0, 1, 0],
)
cs2 = ipk.modeler.create_coordinate_system(
origin=[0, 380, 0],
name="PCB2",
reference_cs="PCB1",
x_pointing=[1, 0, 0],
y_pointing=[0, 1, 0],
)
# Import the electronic packages on the support
PCB1_obj = ipk.modeler.insert_3d_component(
comp_file=os.path.join(temp_folder, "componentLibrary", "PCBAssembly.a3dcomp"),
targetCS=cs1.name, auxiliary_dict=True)
PCB2_obj = ipk.modeler.insert_3d_component(
comp_file=os.path.join(temp_folder, "componentLibrary", "PCBAssembly.a3dcomp"),
targetCS=cs2.name, auxiliary_dict=True)
# To demonstrate once again the flexibility of this method: flatten the nested components structure again and export the whole assembly as a 3d component
ipk.flatten_3d_components()
ipk.modeler.create_3dcomponent(
component_file=os.path.join(temp_folder, "componentLibrary", "MainAssembly.a3dcomp"),
component_name="MainAssembly",
auxiliary_dict=True,
native_components=True,
included_cs=["PCBAssembly1_PCB_Assembly", "PCBAssembly2_PCB_Assembly",
"PCBAssembly1_PCB_Assembly_ref", "PCBAssembly2_PCB_Assembly_ref"]
)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "main_assembly.jpg"))
ipk.close_project(save_project=True)
ipk.release_desktop()
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C:\actions-runner\_work\pyaedt\pyaedt\testenv\lib\site-packages\pyaedt\modeler\cad\Primitives3D.py:1297: ResourceWarning: unclosed file <_io.TextIOWrapper name='D:\\Temp\\pyaedt_prj_PHE\\componentLibrary\\PCBAssembly.a3dcomp.json' mode='r' encoding='cp1252'>
aux_dict = json.load(open(auxiliary_dict, "r"))
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Returning found desktop with PID 13564!
Returning found desktop with PID 13564!
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Returning found desktop with PID 13564!
Returning found desktop with PID 13564!
Returning found desktop with PID 13564!
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Total running time of the script: (2 minutes 17.271 seconds)