Icepak: thermal analysis with 3D components#

from pyaedt import Icepak, generate_unique_folder_name, downloads, settings
import os

# Download needed files

temp_folder = generate_unique_folder_name()
package_temp_name, qfp_temp_name = downloads.download_icepak_3d_component(temp_folder)

aedt_version = "2024.1"

non_graphical = False

ipk = Icepak(projectname=os.path.join(temp_folder, "Heatsink.aedt"),
             specified_version=aedt_version,
             non_graphical=non_graphical,
             close_on_exit=True,
             new_desktop_session=True)

# Remove air region created by default because it is not needed as the heatsink will be exported as a 3DComponent.

ipk.modeler.get_object_from_name("Region").delete()

# Definition of heatsink with boxes
hs_base = ipk.modeler.create_box(origin=[0, 0, 0], sizes=[37.5, 37.5, 2], name="HS_Base")
hs_base.material_name = "Al-Extruded"
hs_fin = ipk.modeler.create_box(origin=[0, 0, 2], sizes=[37.5, 1, 18], name="HS_Fin1")
hs_fin.material_name = "Al-Extruded"
hs_fin.duplicate_along_line([0, 3.65, 0], nclones=11)

ipk.plot(show=False, export_path=os.path.join(temp_folder, "Heatsink.jpg"))

# Definition of a mesh region. First a non-model box is created, then the mesh region is assigned
mesh_box = ipk.modeler.create_box(origin=[-2, -2, -3], sizes=[41.5, 41.5, 24])
mesh_box.model = False
mesh_region = ipk.mesh.assign_mesh_region([mesh_box.name])
mesh_region.UserSpecifiedSettings = True
mesh_region.MaxElementSizeX = "5mm"
mesh_region.MaxElementSizeY = "5mm"
mesh_region.MaxElementSizeZ = "1mm"
mesh_region.MinElementsInGap = "4"
mesh_region.MaxLevels = "2"
mesh_region.BufferLayers = "1"
mesh_region.update()

# Assignment of monitor objects.
hs_fin5_object = ipk.modeler.get_object_from_name("HS_Fin1_5")
point_monitor_position = [0.5 * (hs_base.bounding_box[i] + hs_base.bounding_box[i + 3]) for i in range(2)] + [
    hs_fin5_object.bounding_box[-1]]  # average x,y, top z

ipk.monitor.assign_point_monitor(point_monitor_position, monitor_quantity=["Temperature", "HeatFlux"],
                                 monitor_name="TopPoint")
ipk.monitor.assign_face_monitor(hs_base.bottom_face_z.id, monitor_quantity="Temperature", monitor_name="Bottom")
ipk.monitor.assign_point_monitor_in_object("HS_Fin1_5", monitor_quantity="Temperature", monitor_name="Fin5Center")

# Export the heatsink 3D component and close project. auxiliary_dict is set to true in order to export the
# monitor objects along with the .a3dcomp file.
os.mkdir(os.path.join(temp_folder, "componentLibrary"))
ipk.modeler.create_3dcomponent(
    os.path.join(temp_folder, "componentLibrary", "Heatsink.a3dcomp"),
    component_name="Heatsink",
    auxiliary_dict=True
)
ipk.close_project(save_project=False)

ipk = Icepak(projectname=qfp_temp_name)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "QFP2.jpg"))

# Create dataset for power dissipation.
x_datalist = [45, 53, 60, 70]
y_datalist = [0.5, 3, 6, 9]
ipk.create_dataset(
    "PowerDissipationDataset",
    x_datalist,
    y_datalist,
    zlist=None,
    vlist=None,
    is_project_dataset=False,
    xunit="cel",
    yunit="W",
    zunit="",
    vunit="",
)

# Assign source power condition to the die.
ipk.create_source_power(
    "DieSource",
    thermal_dependent_dataset="PowerDissipationDataset",
    source_name="DieSource"
)

# Assign thickness to the die attach surface.
ipk.create_conduting_plate(face_id="Die_Attach",
                           thermal_specification="Thickness",
                           shell_conduction=True,
                           thickness="0.05mm",
                           solid_material="Epoxy Resin-Typical",
                           bc_name="Die_Attach",
                           )

# Assign monitor objects.
ipk.monitor.assign_point_monitor_in_object("QFP2_die", monitor_quantity="Temperature", monitor_name="DieCenter")
ipk.monitor.assign_surface_monitor("Die_Attach", monitor_quantity="Temperature", monitor_name="DieAttach")

# Export the QFP 3D component and close project. Here the auxiliary dictionary allows exporting not only the monitor
# objects but also the dataset used for the power source assignment.
ipk.modeler.create_3dcomponent(
    os.path.join(temp_folder, "componentLibrary", "QFP.a3dcomp"),
    component_name="QFP",
    auxiliary_dict=True,
    datasets=["PowerDissipationDataset"]
)
ipk.release_desktop(False, False)

ipk = Icepak(projectname=package_temp_name,
             specified_version=aedt_version,
             non_graphical=non_graphical)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "electronic_package_missing_obj.jpg"))

# The heatsink and the QFP are missing. They can be inserted as 3d components. The auxiliary files are needed since
# the aim is to import also monitor objects and datasets. Also, a coordinate system is created for the heatsink so
# that it is placed on top of the AGP.
agp = ipk.modeler.get_object_from_name("AGP_IDF")
cs = ipk.modeler.create_coordinate_system(
    origin=[agp.bounding_box[0], agp.bounding_box[1], agp.bounding_box[-1]],
    name="HeatsinkCS",
    reference_cs="Global",
    x_pointing=[1, 0, 0],
    y_pointing=[0, 1, 0],
)
heatsink_obj = ipk.modeler.insert_3d_component(
    input_file=os.path.join(temp_folder, "componentLibrary", "Heatsink.a3dcomp"), coordinate_system="HeatsinkCS",
    auxiliary_parameters=True)

QFP2_obj = ipk.modeler.insert_3d_component(input_file=os.path.join(temp_folder, "componentLibrary", "QFP.a3dcomp"),
                                           coordinate_system="Global", auxiliary_parameters=True)
ipk.plot(show=False, export_path=os.path.join(temp_folder, "electronic_package.jpg"))

# Create a coordinate system at the xmin, ymin, zmin of the model
bounding_box = ipk.modeler.get_model_bounding_box()
cs_pcb_assembly = ipk.modeler.create_coordinate_system(
    origin=[bounding_box[0], bounding_box[1], bounding_box[2]],
    name="PCB_Assembly",
    reference_cs="Global",
    x_pointing=[1, 0, 0],
    y_pointing=[0, 1, 0],
)

# Export of the whole assembly as 3d component and close project. First, a flattening is needed because nested 3d
# components are not natively supported. Then it is possible to export the whole package as 3d component. Here the
# auxiliary dictionary is needed to export monitor objects, datasets and native components.
ipk.flatten_3d_components()
ipk.modeler.create_3dcomponent(
    component_file=os.path.join(temp_folder, "componentLibrary", "PCBAssembly.a3dcomp"),
    component_name="PCBAssembly",
    auxiliary_dict=True,
    included_cs=["Global", "HeatsinkCS", "PCB_Assembly"],
    reference_cs="PCB_Assembly"
)

ipk.release_desktop(True, True)