place_instance#

Stackup.place_instance(component_edb, angle=0.0, offset_x=0.0, offset_y=0.0, offset_z=0.0, flipped_stackup=True, place_on_top=True, solder_height=0)[source]#

Place current Cell into another cell using 3d placement method. Flip the current layer stackup of a layout if requested. Transform parameters currently not supported.

Parameters:

component_edbEdb: Cell to place in the current layout.
angledouble, optional: The rotation angle applied on the design.
offset_xdouble, optional: The x offset value. The default value is 0.0.
offset_ydouble, optional: The y offset value. The default value is 0.0.
offset_zdouble, optional: The z offset value. (i.e. elevation offset for placement relative to the top layer conductor). The default value is 0.0, which places the cell layout on top of the top conductor layer of the target EDB.
flipped_stackupbool, optional: Either if the current layout is inverted. If True and place_on_top is True the stackup will be flipped before the merge.
place_on_topbool, optional: Either if place the component_edb layout on Top or Bottom of destination Layout.
solder_heightfloat, optional: Solder Ball or Bumps eight. This value will be added to the elevation to align the two layouts.

Returns:

bool: True when succeed False if not.

Examples

>>> edb1 = Edb(edbpath=targetfile1,  edbversion="2021.2")
>>> edb2 = Edb(edbpath=targetfile2, edbversion="2021.2")
>>> hosting_cmp = edb1.components.get_component_by_name("U100")
>>> mounted_cmp = edb2.components.get_component_by_name("BGA")
>>> edb1.stackup.place_instance(edb2, angle=0.0, offset_x="1mm",
...                                   offset_y="2mm", flipped_stackup=False, place_on_top=True,
...                                   )